THERMALRIGHT PAD 120x20x1.0mm
- 【EASY & CONVENIENT TO USE】: Dimension 120x20x1.0mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
- 【WIDELY APPLICATION】:Perfectly replaces traditional heatsink compound grease paste, great for PC,Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED,PS4, auto mechanics, computer host, laptop,solid-state drives,Gaming equipment, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
- 【NO RISK PURCHASE】: We committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads,we’ll reply you asap.
- This Odyssey thermal pad is rated voltage up to 9.8KV and has a thermal conductivity of 12.8 W/mk and insulation. It is safe to use without electricity.
THERMALRIGHT PAD 120x20x1.0mm
SPECIFICATIONS:
Thermal Conductivity（W / m-k)：12.8 W/mk
Color：Gray
Density（g/cc)：3.1±0.2
Hardness（Sc)：30~55
Specifications：120×20 mm
Breakdown Voltage：9.8KV
Electrically Conductive：NO
Thermal Pad Thickness：1.0 mm
Related Products
Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.
This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity.
This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.
Available on backorder
- Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks
- Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment
- The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat
- Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components
- Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate
Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.
This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity.
This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.
Available on backorder
- 【Easy to Install】Dimension 120x120x0.5mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap
- 【Excellent Thermal Conductivity】Upgraded thermal silica gel material with 12.8 W/mk thermal conductivity, thermal pad greatly improve the heat transfer between the electronic elements
- 【Plasticity】Good elasticity and compression properties, contact with any electrical traces wouldn’t result in damage of any sort
- 【Widely Application】One pad is multi-purpose, insulated and non-conductive, it is safe in use, used for graphics card memory North and South Bridge, RDRAM memory module, communication equipment, SSD solid state hard drive, game console equipment, car control device
Available on backorder
Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.
This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity.
This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.
Available on backorder
- 【EXCELLENT THERMAL CONDUCTIVITY】: Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
- 【SUPER RELIABLE & DURABLE】: High temperature performance in -40 ℃ – 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
- 【EASY & CONVENIENT TO USE】: Dimension 120x20x2mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
- 【WIDELY APPLICATION】: Perfectly replaces traditional heatsink compound grease paste, great for Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules
Available on backorder
- 【Easy to Install】Dimension 120x20x3mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap
- 【Excellent Thermal Conductivity】Upgraded thermal silica gel material with 12.8 W/mk thermal conductivity, thermal pad greatly improve the heat transfer between the electronic elements
- 【Plasticity】Good elasticity and compression properties, contact with any electrical traces wouldn’t result in damage of any sort
- 【Widely Application】One pad is multi-purpose, insulated and non-conductive, it is safe in use, used for graphics card memory North and South Bridge, RDRAM memory module, communication equipment, SSD solid state hard drive, game console equipment, car control device
Available on backorder
- [ EXCELLENT THERMAL CONDUCTIVITY ]：Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improves the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
- [ SUPER RELIABLE & DURABLE ]：High temperature performance in -40 ℃——205 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
- [ EASY & CONVENIENT TO USE ]：Dimension 120x20x2.0mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
- [ WIDELY APPLICATION ]：It is a perfect substitute for traditional radiator compound grease, very suitable for control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, automotive mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
Available on backorder
Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.
This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity.
This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.
Available on backorder
- 【EXCELLENT THERMAL CONDUCTIVITY】:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdowm voltage: 9.8KV; Conductivity: None,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
- 【SUPER RELIABLE & DURABLE】:High temperature performance in -40 ℃ – 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
- 【EASY & CONVENIENT TO USE】:Dimension 120x120x2.5mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
- 【WIDELY APPLICATION】:Perfectly replaces traditional heatsink compound grease paste, great for PC,Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED,PS4, auto mechanics, computer host, laptop,solid-state drives,Gaming equipment, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
Available on backorder
Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience.
This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity.
This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.
Available on backorder
- 【Easy to Install】Dimension 120x120x2.0mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap
- 【Excellent Thermal Conductivity】Upgraded thermal silica gel material with 12.8 W/mk thermal conductivity, thermal pad greatly improve the heat transfer between the electronic elements
- 【Plasticity】Good elasticity and compression properties, contact with any electrical traces wouldn’t result in damage of any sort
- 【Widely Application】One pad is multi-purpose, insulated and non-conductive, it is safe in use, used for graphics card memory North and South Bridge, RDRAM memory module, communication equipment, SSD solid state hard drive, game console equipment, car control device
Available on backorder
Reviews
There are no reviews yet.